FB Temperature Boron Modified Phenolic

FB temperature boron modified phenolic resin is a chemical in whose molecular structure B-O key is introduced, since the bond energy of B-O key is stronger than C-C key connecting benzene ring of general phenolic resin, so its oxidation resistance and high temperature resistance performances are superior to the conventional phenolic resin, and also has the prominent features of thermal stability, ablation resistance, high carbon residue, flame retarding, less smoke, low toxicity and good manufacturability. It has therefore been widely used in some sophisticated fields and other civilian industries such as high temperature adhesives, fire retardant coating, ablation resistant material, resin based composite materials, insulation materials, carbon/carbon materials, carbon/ceramic material, phenolic resin based carbonized functional materials, etc.

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FB temperature boron modified phenolic

MAJOR FEATURES

(1) The product can be supplied to users in solid, liquid and powder of high molecular weight;

(2) Its decomposition temperature is above 500℃, still remains 50% carbon residue rate at1000℃, featuring a sound thermal aging performance;

(3) Its oxygen index is 48.5, non-combustible, generally smokeless and non- toxicity;

(4) The linear ablative rate is -0.079 mm/s, mass ablation rate is 0.0333 g/s;

(5) It can be used to prepare multiple curing agents of epoxy resin, which is able to make E type epoxy resin tolerate high temperature up to 200 ℃ for a long time, still remain the strength of 1.5 Mpa by 500℃/1h. Moreover, it can also been co-applied with phenolic epoxy and polyfunctional epoxy resin;

(6) FB resin can be cured by heating without adding hexamethylenetetramine; (7) It can be reacted with epdm, nitrile rubber of various synthetic rubbers so as to improve the ablation resistance, flame retarding properties and strength of rubber products;

(8) It can be dissolved in solvent in environment protection. With the character of low viscosity, it can meet the requirements of impregnation/densification of resin matrix ablation material, C/C material and carbon graphite products.

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